CEMWorks Inc.

CEMWorks Inc. We enable the next generations of smart cities, connected vehicles, and electronic components.

Using our revolutionary EM simulation technology, we allow industries to solve the design problem.

𝐂𝐨𝐦𝐦𝐨𝐧 𝐛𝐨𝐭𝐭π₯𝐞𝐧𝐞𝐜𝐀𝐬 𝐒𝐧 π­π¨ππšπ²β€™π¬ π’πˆ/𝐏𝐈 𝐚𝐧𝐚π₯𝐲𝐬𝐒𝐬As models become larger and more interconnected, simulation time and memory ...
07/22/2026

𝐂𝐨𝐦𝐦𝐨𝐧 𝐛𝐨𝐭𝐭π₯𝐞𝐧𝐞𝐜𝐀𝐬 𝐒𝐧 π­π¨ππšπ²β€™π¬ π’πˆ/𝐏𝐈 𝐚𝐧𝐚π₯𝐲𝐬𝐒𝐬

As models become larger and more interconnected, simulation time and memory requirements can quickly become limiting factors.

Engineering teams often face three recurring challenges:
- Long full-wave simulation times
- High memory and compute requirements
- The need to simplify or partition models to make them solvable

These constraints can reduce the number of design options teams evaluate and make it harder to get the full network properties of a complete design.

Addressing these bottlenecks requires more than the brute force method of adding computing resources. It requires a simulation approach that scales more efficiently as model complexity grows.

Emerald is designed to make full-wave analysis more manageable for dense, layered, high-frequency structures, helping engineering teams move from large design models to useful SI/PI results within practical development timelines.

Reach out to begin your evaluation now: cemworks.com







CEMWorks recently presented at ECTC 2026 in Orlando on BEM-Based Characterization of a D-Band On-Chip Patch Antenna Arra...
06/09/2026

CEMWorks recently presented at ECTC 2026 in Orlando on BEM-Based Characterization of a D-Band On-Chip Patch Antenna Array.

The paper explores how contactless over-the-air measurement can be combined with Boundary Element Method simulation to better characterize on-chip antennas above 100 GHz.

This matters because on-chip and in-package antennas are becoming increasingly important for next-generation wireless, sensing, and high-frequency electronic systems. But as antennas move closer to chips and packages, both measurement and simulation become more challenging.
By cross-validating contactless measurements with BEM simulation, the work demonstrates a practical path toward more accurate and scalable design workflows for D-band antenna arrays.

Read more here: https://wpg.d56.myftpupload.com/cemworks-presents-d-band-on-chip-antenna-research-at-ectc-2026-2/

The RF and microwave industry is pushing the limits of frequency, bandwidth, and integration. And the electromagnetic ch...
06/09/2026

The RF and microwave industry is pushing the limits of frequency, bandwidth, and integration. And the electromagnetic challenges are growing just as quickly.

CEMWorks will be attending IMS 2026 in Boston, one of the premier events for RF, microwave, and high-frequency engineering. As antennas, advanced packaging, high-speed interconnects, and mmWave systems become increasingly complex, engineering teams need simulation tools that can deliver both accuracy and scalability. Our electromagnetic simulation technology helps engineers analyze and optimize these designs with greater confidence, reducing risk before fabrication and accelerating development cycles.

If you’ll be attending IMS, let's connect!

Book a meeting here: https://calendar.app.google/FP4hTncGi1KBUki79

Read more here: https://cemworks.com/cemworks-to-be-in-boston-during-ims-2026/

CEMWorks was proud to present alongside NXP Semiconductors at SCEE 2026 in Lisbon, Portugal, on the increasingly critica...
05/15/2026

CEMWorks was proud to present alongside NXP Semiconductors at SCEE 2026 in Lisbon, Portugal, on the increasingly critical challenge of efficient analysis for high-speed interconnects.
As modern electronic systems push toward higher speeds, greater density, and more advanced packaging architectures, electromagnetic effects within interconnect structures are becoming a major design bottleneck. Advanced EM simulation is playing an essential role in helping engineering teams predict signal behaviour, reduce design risk, and accelerate development before fabrication.
The presentation reflects CEMWorks’ continued focus on next-generation EM simulation technologies for complex electronic systems, including advanced IC packaging, interposers, antenna-in-package designs, and high-frequency structures.

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280/100 Innovation Drive
Winnipeg, MB
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